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Mutual influence of Auger and non-radiative recombination processes under silicon femtosecond laser irradiation

机译:飞秒激光辐照下俄歇与非辐射复合过程的相互影响

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摘要

The results of theoretical study of the contribution of recombination processes in additional heating of the surface of monocrystalline silicon during multipulse femtosecond laser processing are presented to discussion. The numerical evaluations are made in regimes of the laser radiation below the ablation threshold, when the microgeometry of the surface is formed due to the processes of self-organization. The influence of Auger recombination processes on the photoexcitation of the semiconductor during the pulse and relaxation after the pulse is studied in detail. It is shown that the additional heating of the surface due to non-radiative recombination is extremely small at pulse repetition rate 10 Hz-1 MHz. Mutual influence of recombination processes of both types is shown.
机译:讨论了在多脉冲飞秒激光加工过程中重组过程对单晶硅表面额外加热的贡献的理论研究结果。当由于自组织过程形成表面的微观几何形状时,在低于烧蚀阈值的激光辐射范围内进行数值评估。详细研究了俄歇复合过程对半导体光脉冲激发和脉冲后弛豫的影响。结果表明,在脉冲重复频率为10 Hz-1 MHz时,由于非辐射复合而导致的表面额外热量极小。显示了两种类型的重组过程的相互影响。

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