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Po'man's Thermalmodeling For Pcbs

机译:鲍曼的PCB热模型

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摘要

Thermal modeling printed circuit boards (PCBs) in high power density applications is a critical part of circuit design. With more discrete components condensed on smaller PCBs, heat flow starts to play a big role. After all, consumers don't want to have laptops burning their thighs or desktops exuding the nauseous fumes of plastic. Much thought, analysis, and testing are put into electronic designs to properly cool and dissipate heat. As a rule of thumb, the more analysis and testing that is needed, the more resources, time, and money are needed.
机译:高功率密度应用中的热建模印刷电路板(PCB)是电路设计的关键部分。随着更多分立元件被冷凝在更小的PCB上,热流开始发挥重要作用。毕竟,消费者不想让笔记本电脑燃烧大腿或台式机而散发着令人恶心的塑料烟雾。电子设计中需要进行大量的思考,分析和测试,以适当地冷却和散热。根据经验,需要进行更多的分析和测试,则需要更多的资源,时间和金钱。

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