RELAP5-3D multidimentsional heat Conduction enclosure model For rbmk reactor application

摘要

A heat conduction enclosure model is conceived and implemented by RELAP5-3D between heat structures. The suggested model uses a lumped parameter model that is generally applicable to multidimensional calculational domain. This new model is applied to calculation of RBMK reactor core graphite blocks and is compared to The commercially available Fluid Dynamics Analysis Package (FIDAP) finite element code.