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首页> 外文期刊>Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment >Characterization of 13 and 30 μm thick hydrogenated amorphous silicon diodes deposited over CMOS integrated circuits for particle detection application
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Characterization of 13 and 30 μm thick hydrogenated amorphous silicon diodes deposited over CMOS integrated circuits for particle detection application

机译:表征沉积在CMOS集成电路上的13和30μm厚的氢化非晶硅二极管的特性,用于颗粒检测应用

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摘要

We present the experimental results obtained with a novel monolithic silicon pixel detector which consists in depositing a n-i-p hydrogenated amorphous silicon (a-Si:H) diode straight above the readout ASIC (this technology is called Thin Film on ASIC, TFA). The characterization has been performed on 13 and 30 μm thick a-Si:H films deposited on top of an ASIC containing a linear array of high-speed low-noise transimpedance amplifiers designed in a 0.25 μm CMOS technology. Experimental results presented have been obtained with a 600 nm pulsed laser. The results of charge collection efficiency and charge collection speed of these structures are discussed.
机译:我们介绍了使用新颖的整体式硅像素检测器获得的实验结果,该检测器包括在读出的ASIC上方直接沉积一个n-i-p氢化非晶硅(a-Si:H)二极管(该技术称为ASIC薄膜,TFA)。表征是在沉积在ASIC顶部的13和30μm厚的a-Si:H膜上进行的,该ASIC包含采用0.25μmCMOS技术设计的高速低噪声跨阻放大器的线性阵列。提出的实验结果已通过600 nm脉冲激光获得。讨论了这些结构的电荷收集效率和电荷收集速度的结果。

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