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首页> 外文期刊>Nuclear instruments and methods in physics research >Surface leakage current control with heterojunction-type passivation in semi-insulating CdZnTe material
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Surface leakage current control with heterojunction-type passivation in semi-insulating CdZnTe material

机译:半绝缘CdZnTe材料的异质结钝化表面泄漏电流控制

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Inter-pixel resistance in the planar structure X-ray or gamma-ray detector has severe effects on signal cross-talk and the signal integration time. Generally, Br-MeOH etching in Cd-based compounds leaves a Te-rich or Cd-rich surface resulting from selective etching. The etching then converts the Te-rich or Cd-rich surface in air into TeO_2 or CdO oxides, which exhibit low resistance. To reduce the surface recombination, we adopted (NH_4)_2S for surface passivation in the polycrystalline CdZnTe:Cl grown by thermal evaporation method. The optimization of passivation was confirmed by I-V measurement and X-ray photoemission spectroscopy (XPS) analysis. From the I-V curve, we confirmed that the surface resistance was considerably increased after passivation with (NH_4)_2S. XPS data showed that (NH_4)_2S passivation removed conductive TeO_2 layers and induced formation of insulating CdTeO_3 and CdS layers. A heterojunction by the thin CdS layer and CdZnTe was formed.
机译:平面结构X射线或伽马射线检测器中的像素间电阻会严重影响信号串扰和信号积分时间。通常,在Cd基化合物中进行Br-MeOH蚀刻会由于选择性蚀刻而留下富含Te或Cd的表面。然后,蚀刻将空气中富含Te或Cd的表面转化为表现出低电阻的TeO_2或CdO氧化物。为了减少表面复合,我们采用(NH_4)_2S进行热蒸发法生长的多晶CdZnTe:Cl表面钝化。钝化的优化通过I-V测量和X射线光电子能谱(XPS)分析得以确认。从I-V曲线,我们确认在用(NH_4)_2S钝化后表面电阻显着增加。 XPS数据表明(NH_4)_2S钝化去除了导电TeO_2层,并诱导了绝缘CdTeO_3和CdS层的形成。由薄的CdS层和CdZnTe形成异质结。

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