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Monolithic pixels on moderate resistivity substrate and sparsifying readout architecture

机译:中等电阻率基板上的单块像素和稀疏的读出架构

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摘要

The LePix projects aim realizing a new generation monolithic pixel detectors with improved performances at lesser cost with respect to both current state of the art monolithic and hybrid pixel sensors. The detector is built in a 90 nm CMOS process on a substrate of moderate resistivity. This allows charge collection by drift while maintaining the other advantages usually offered by MAPS, like having a single piece detector and using a standard CMOS production line. The collection by drift mechanism, coupled to the low capacitance design of the collecting node made possible by the monolithic approach, provides an excellent signal to noise ratio straight at the pixel cell together with a radiation tolerance far superior to conventional un-depleted MAPS. The excellent signal-to-noise performance is demonstrated by the device ability to separate the 6 keV ~(55)Fe double peak at room temperature. To achieve high granularity (10-20 μm pitch pixels) over large detector areas maintaining high readout speed, a completely new compressing architecture has been devised. This architecture departs from the mainstream hybrid pixel sparsification approach, which uses in-pixel logic to reduce data, by using topological compression to minimize pixel area and power consumption.
机译:LePix项目旨在实现新一代单片像素检测器,相对于当前的最新单片像素传感器和混合像素传感器,它们以更低的成本实现了更高的性能。该检测器以90 nm CMOS工艺构建在中等电阻率的基板上。这样就可以通过漂移收集电荷,同时保持MAPS通常提供的其他优势,例如具有单片检测器和使用标准CMOS生产线。通过漂移机制进行的收集,再加上通过单片方法实现的收集节点的低电容设计,可直接在像素单元处提供出色的信噪比,并具有远远优于传统未耗尽MAPS的辐射容限。该器件在室温下分离6 keV〜(55)Fe双峰的能力证明了其出色的信噪性能。为了在保持高读出速度的大检测器区域上实现高粒度(10-20μm间距像素),已经设计了一种全新的压缩架构。该架构与主流的混合像素稀疏化方法不同,后者通过使用拓扑压缩来最小化像素面积和功耗,从而使用像素内逻辑来减少数据。

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