EMC Techniques in a High-density Packaging System for Telecommunication Equipment

摘要

Electromagnetic interference (EMI) countermeasures in the high-density packaging system (Hi-PAS) have been developed to improve the electromagnetic compatibility (EMC) of telecommunication equipment. The techniques presented here enable the equipment to decrease EMI without degrading packaging density in a cabinet. Research and development on countermeasure cables are also being conducted for further improvement.