Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging For High-Speed Telecommunication Systems

摘要

The small planar packaging (SPP) system described here can be combined with card-on-board (COB) packaging in high-speed asynchronous transfer mode (ATM) switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density, high packaging density and high cooling capability. Prototype SPP system with air flow control structure for switching MCMs is constructed. Each MCM contained a 3×5 array of low thermal resistance butt-lead pin-grid-array on a glass ceramic substrate measuring 100×170 mm with a plate fin heat-sink.