Mitsubishi Electric Corp. has developed an electron beam type soldering machine that is a new application of the electron beam machining technology. A solder of lower melting point than that of the member to be welded together is interpositioned at the welding part and a highly concentrated electron beam of over 4kW irradiated for about 100ms, by which the joint part is heated locally and the solder melted to weld the electrode plate and the current collection plate together. The solder is melted by heat conductance from the heated current collection plate and a fillet formed with respect to the T-joint, so the joining area will be large and the stress concentration minimal to provide excellent joining strength.
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