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Micrometre-scale silicon electro-optic modulator

机译:微米级硅光电调制器

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Metal interconnections are expected to become the limiting factor for the performance of electronic systems as transistors continue to shrink in size. Replacing them by optical interconnections, at different levels ranging from rack-to-rack down to chip-to-chip and intra-chip interconnections, could provide the low power dissipation, low latencies and high bandwidths that are needed(1-4). The implementation of optical interconnections relies on the development of micro-optical devices that are integrated with the microelectronics on chips. Recent demonstrations of silicon low-loss waveguides(5-7), light emitters(8), amplifiers(9-11) and lasers(12,13) approach this goal, but a small silicon electro-optic modulator with a size small enough for chip-scale integration has not yet been demonstrated. Here we experimentally demonstrate a high-speed electro-optical modulator in compact silicon structures. The modulator is based on a resonant light-confining structure that enhances the sensitivity of light to small changes in refractive index of the silicon and also enables high-speed operation. The modulator is 12 micrometres in diameter, three orders of magnitude smaller than previously demonstrated. Electro-optic modulators are one of the most critical components in optoelectronic integration, and decreasing their size may enable novel chip architectures.
机译:随着晶体管尺寸的不断缩小,金属互连有望成为电子系统性能的限制因素。从机架到机架再到芯片到芯片以及芯片内部互连的不同级别上的光互连来替换它们,可以提供所需的低功耗,低延迟和高带宽(1-4)。光学互连的实现依赖于与微电子芯片集成在一起的微光学器件的开发。硅低损耗波导(5-7),光发射器(8),放大器(9-11)和激光器(12,13)的最新演示都达到了这一目标,但是它是一个尺寸足够小的小型硅电光调制器用于芯片规模集成的技术尚未得到证明。在这里,我们通过实验证明了紧凑型硅结构中的高速电光调制器。调制器基于谐振光限制结构,该结构增强了光对硅折射率的微小变化的敏感性,并实现了高速操作。调制器的直径为12微米,比以前展示的小三个数量级。电光调制器是光电集成中最关键的组件之一,减小其尺寸可以实现新颖的芯片架构。

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