Wireless intrachip/interchip interconnections utilising tapered slot antennas for ultra-large-scale integration technology

摘要

This study describes wireless intra and interchip interconnections to overcome fundamental limits of the hard-wired interconnections that create the bottleneck for any further developments in the ultra-large-scale integration (ULSI) technology. Tapered slot antennas of compact size are proposed for efficient transmission of signals within the frequency range 20¿30 GHz between different pins of an ULSI chip in system-on-chip technology or between different microelectronic modules in system-in-package technology. The simulated results using fullwave electromagnetic simulations indicate the superiority of the proposed antenna compared with other designs available in the literature. The presented antennas have a differential input to cancel any noise and/or interference that may affect negatively on performance of the wireless interconnections. Moreover, they have an ultra wideband performance, which is essential for the ever-increasing demand on extremely high data rates. The simulated results show that the main method of propagation for the electromagnetic fields between the antennas of a wireless interconnection is via the silicon substrate, whereas the free-space propagation is limited in value.