首页> 外文期刊>Microwaves, Antennas & Propagation, IET >Surface-impedance quasi-transverse electromagnetic approach for the efficient calculation of conductor losses in multilayer single and coupled microstrip lines
【24h】

Surface-impedance quasi-transverse electromagnetic approach for the efficient calculation of conductor losses in multilayer single and coupled microstrip lines

机译:表面阻抗准横向电磁方法可有效计算多层单条和耦合微带线中的导体损耗

获取原文
获取原文并翻译 | 示例
           

摘要

In this study the authors present a new surface-impedance model for the accurate computation of the effect of metal losses on the parameters of printed microstrip lines. The novelty of the authors' approach lies in the fast and direct calculation of the tangential magnetic fields above and below the strip conductors, which allows us to develop a very efficient quasi-transverse electromagnetic (TEM) solution for the conductor losses of multilayer single or coupled microstrip lines. The overall computational effort of the authors' method is much less than that required by purely numerical approaches. The accuracy of the method has been verified by comparison with other techniques, including a general-purpose full-wave finite elements method. It is also shown that the proposed method provides better results than other previously surface-impedance approaches.
机译:在这项研究中,作者提出了一种新的表面阻抗模型,用于精确计算金属损耗对印刷微带线参数的影响。作者方法的新颖之处在于,可以对带状导体上方和下方的切向磁场进行快速,直接的计算,这使我们能够开发出一种非常有效的准横向电磁(TEM)解决方案,以解决多层单层或多层导体损耗的问题。耦合的微带线。作者方法的总体计算工作量比纯数值方法所需的总工作量少得多。通过与包括通用全波有限元方法在内的其他技术进行比较,验证了该方法的准确性。还表明,所提出的方法提供了比其他先前的表面阻抗方法更好的结果。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号