3D LDS Components for New Production Opportunities

摘要

The trend that has been dominating electronic and mecha-tronic products for many years is clear: components must get smaller in size, while packing in more functions. Also, in order to maintain their market positions, manufacturers in the communications technology sector are under tremendous pressure to continuously launch new products in shorter intervals, while still making them stand out from the crowd. Technologies such as 3D Molded Interconnect Devices (MID) enable new products to be produced with unprecedented functionality. In particular, LPKF's Laser Direct Structuring (LDS) technology offers the benefits of reliable, efficient and productive technology, with the added advantages of economic prototyping processes and a short production lead time.