How RF SiP technology is moving into the wireless design mainstream

摘要

RF SiP technology is an enabling packaging platform for wireless communication, which is constrained by the fact that, today, SiP design is an "expert engineering" process—one that is not scalable as a general design solution. To facilitate a move to mainstream SiP implementation, an integrated, scalable SiP design solution must be developed and reference flows provided. The new solution will involve a change in design methodology for SiP products. Supported by a new technology, the methodology will enable engineers to co-design ICs, IC packages, and the targeted PCB, from concept to production. This article describes the basic design challenges of SiP methodology and suggests a manageable, cost-effective solution.