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A New Sub-Millimeter Wave Power Amplifier Topology Using Large Transistors

机译:使用大型晶体管的新型亚毫米波功率放大器拓扑

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摘要

In this letter, a new power amplifier topology is demonstrated which allows the use of large (120 $mu$ m/transistors) at extremely high frequency. This is accomplished by using compact matching networks consisting of coplanar waveguide transmission lines and metal-insulator-metal capacitors to match each of the three amplifier stages. The resulting amplifier achieves a peak gain of 16.5 dB at 260 GHz. Power measurements indicate that the chip achieves $> $5.9 mW (unsaturated) of output power and 4% power added efficiency at a frequency of 270 GHz, where the output power is limited by the available source drive power. This power level from a single transistor represents a significant improvement at this frequency band.
机译:在这封信中,展示了一种新的功率放大器拓扑结构,该拓扑结构允许在极高的频率下使用大型功率放大器(120μm/晶体管)。这是通过使用紧凑的匹配网络来实现的,该匹配网络由共面波导传输线和金属-绝缘体-金属电容器组成,以匹配三个放大器级的每一个。所得的放大器在260 GHz时达到16.5 dB的峰值增益。功率测量表明,该芯片在270 GHz频率下达到$> $ 5.9 mW(不饱和)输出功率和4%的功率附加效率,其中输出功率受可用的源驱动功率限制。来自单个晶体管的该功率电平表示在该频带上的显着改善。

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