首页> 外文期刊>IEEE microwave and wireless components letters >A 280–310 GHz InAlAs/InGaAs mHEMT Power Amplifier MMIC with 6.7–8.3 dBm Output Power
【24h】

A 280–310 GHz InAlAs/InGaAs mHEMT Power Amplifier MMIC with 6.7–8.3 dBm Output Power

机译:具有6.7–8.3 dBm输出功率的280–310 GHz InAlAs / InGaAs mHEMT功率放大器MMIC

获取原文
获取原文并翻译 | 示例
           

摘要

This letter presents a broadband power amplifier (PA) millimeter-wave integrated circuit (MMIC) demonstrating 6.7-8.3-dBm measured output power from 280 to 310 GHz at -5-dBm input power. The measured small-signal gain is 15-20 dB for 266-330 GHz, which is the maximum frequency that could be measured. A dc power of 521 mW is required for this four-stage amplifier circuit using four cascode amplifier cells in parallel. The cascode PA cell is implemented with thin-film microstrip lines on the wafer front side using two two-finger devices with 10-mu m finger width in parallel. Due to the compact cascode cell topology, the total gate width of 160 mu m is realized requiring only 400 mu m x 800 mu m chipsize for the four-stage amplifier without pads. The reported output power represents the state of the art for mHEMT-based PA MMICs between 280 and 310 GHz.
机译:这封信介绍了宽带功率放大器(PA)毫米波集成电路(MMIC),该器件在-5-dBm输入功率下展示了从280至310 GHz的6.7-8.3-dBm实测输出功率。对于266-330 GHz,测得的小信号增益为15-20 dB,这是可以测量的最大频率。使用四个并联的共源共栅放大器单元,此四级放大器电路需要521 mW的直流功率。共源共栅PA单元使用两个10微米手指宽度平行的两指器件在晶片正面上使用薄膜微带线实现。由于紧凑的共源共栅单元拓扑结构,因此实现了160μm的总栅极宽度,而无需焊盘的四级放大器仅需要400μmx 800μm的芯片尺寸。报告的输出功率代表280至310 GHz之间基于mHEMT的PA MMIC的最新技术水平。

著录项

相似文献

  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号