...
首页> 外文期刊>Microfluidics and nanofluidics >A reduced-order model for whole-chip thermal analysis of microfluidic lab-on-a-chip systems
【24h】

A reduced-order model for whole-chip thermal analysis of microfluidic lab-on-a-chip systems

机译:用于微流体芯片实验室系统的全芯片热分析的降阶模型

获取原文
获取原文并翻译 | 示例

摘要

This paper presents a Krylov subspace projection-based reduced-order model (ROM) for whole microfluidic chip thermal analysis, including conjugate heat transfer. Two key steps in the reduced-order modeling procedure are described in detail: (1) the acquisition of a 3D full-scale computational model in the state-space form to capture the dynamic thermal behavior of the entire microfluidic chip; and (2) the model order reduction using the block Arnoldi algorithm to markedly lower the dimension of the full-scale model. Case studies using practically relevant thermal microfluidic chip are undertaken to establish the capability and to evaluate the computational performance of the reduced-order modeling technique. The ROM is compared against the full-scale model and exhibits good agreement in spatiotemporal thermal profiles (<0.5 % relative error in pertinent time scales) and over three-orders-of-magnitude acceleration in computational speed. The salient model reusability and real-time simulation capability render it amenable for operational optimization and in-line thermal control and management of microfluidic systems and devices.
机译:本文提出了一种基于Krylov子空间投影的降阶模型(ROM),用于整个微流控芯片热分析,包括共轭传热。降阶建模过程中的两个关键步骤被详细描述:(1)以状态空间形式获取3D满量程计算模型,以捕获整个微流体芯片的动态热行为; (2)使用块Arnoldi算法降低模型阶数,以显着降低全尺寸模型的尺寸。使用实际相关的热微流体芯片进行了案例研究,以建立能力并评估降阶建模技术的计算性能。将ROM与完整模型进行比较,并在时空热剖面(相关时间尺度上的相对误差小于0.5%)和计算速度超过三量级的加速度方面显示出良好的一致性。显着的模型可重用性和实时仿真功能使其可用于微流体系统和设备的操作优化以及在线热控制和管理。

著录项

  • 来源
    《Microfluidics and nanofluidics》 |2014年第2期|369-380|共12页
  • 作者单位

    CFD Research Corporation,Huntsville,AL 35805,USA;

    CFD Research Corporation,Huntsville,AL 35805,USA;

    CFD Research Corporation,Huntsville,AL 35805,USA;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号