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Comprehensive assessment of MEMS double touch mode capacitive pressure sensor on utilization of SiC film as primary sensing element: Mathematical modelling and numerical simulation

机译:利用SiC薄膜作为主要传感元件的MEMS双点触摸模式电容式压力传感器的综合评估:数学建模和数值模拟

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Capacitive Pressure Sensors have consistently been an indispensable application of MEMS (Micro Electro Mechanical Systems) because of their utility and precision. Silicon has proven to be a dominant material in MEMS based sensor design but it is unfit for applications operating in harsh environmental conditions. Silicon Carbide is a justified replacement to Silicon in these conditions due to its solitary attribute of robustness and high temperature tolerance. This work introduces a Silicon Carbide and Aluminum Nitride based DTMCPS (Double Touch Mode Capacitive Pressure Sensor) with a substrate notch. Condensed yet exhaustive step by step mathematics of key performance parameters have been detailed for the sensor under study. This is done to provide a detailed understanding of the underlying physical and mathematical principles. It also aims to provide a fast analysis model for prototyping the sensor to bypass the need for bulky simulation software. A Finite Element Analysis (FEM) analysis for the design was conducted using COMSOL and the results agree with the mathematical model. It is evident from numerical simulation and the FEM analysis that the proposed sensor provides better performance than comparable designs reported in literature.
机译:电容式压力传感器由于其实用性和精确性,一直是MEMS(微机电系统)必不可少的应用。事实证明,硅是基于MEMS的传感器设计中的主要材料,但不适用于在恶劣环境条件下运行的应用。在这些条件下,碳化硅是硅的合理替代品,因为它具有坚固性和高温耐受性的独特属性。这项工作介绍了基于碳化硅和氮化铝的DTMCPS(双接触模式电容式压力传感器),具有基板切口。对于正在研究的传感器,已经详细描述了关键性能参数的浓缩而又详尽的逐步数学。这样做是为了提供对基本物理和数学原理的详细理解。它还旨在提供一种快速分析模型,以对传感器进行原型制作,从而无需使用庞大的仿真软件。使用COMSOL对设计进行了有限元分析(FEM),结果与数学模型相符。从数值模拟和FEM分析可以明显看出,与文献报道的同类设计相比,该传感器提供了更好的性能。

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