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Selective microfabrication of silver electrodes inside a microchannel by multiphase laminar flow with density difference

机译:多通道层流具有密度差的微通道内银电极的选择性微加工

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摘要

In this paper, we propose a selective microfabrication technique of metal electrodes in a microchannel. The technique is based on the chemical deposition and the interface rotation of laminar flows among three multiphase fluids. Silver electrodes were patterned by electroless silver deposition only on the wall of the microchannel where the interface between a silver electroless plating solution and a reducer solution makes contact with the wall. A third fluid having a lower (or higher) density compared to the two solutions was introduced into the microchannel at the same time. The density difference between the two solutions and the third fluid induced the stable rotations of the interfaces between two among the three fluids. The third fluid having a different density, therefore, enabled us to selectively position the interfaces between the electroless plating and reducer solutions on the wall of the microchannel. We have demonstrated the fabrication of a single electrode and double electrodes on the bottom walls of microchannels based on the suggested microfabrication technique by changing number of streams, injection locations, flow rates, and flow duration time.
机译:在本文中,我们提出了一种微通道中金属电极的选择性微细加工技术。该技术基于三种多相流体之间的化学沉积和层流界面旋转。仅在微通道的壁上通过无电银沉积对银电极进行构图,在该微通道的壁上,无电镀银溶液和还原剂溶液之间的界面与壁接触。与两种溶液相比具有更低(或更高)密度的第三种流体被同时引入微通道。两种溶液和第三种流体之间的密度差引起了三种流体中两种之间的界面的稳定旋转。因此,具有不同密度的第三种流体使我们能够选择性地将化学镀和还原剂溶液之间的界面放置在微通道壁上。我们已经证明了通过建议的微细加工技术,通过改变料流的数量,注入位置,流速和流动时间,可以在微通道底壁上制造单电极和双电极。

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