Effect of mechanical process parameters on friction behavior and material removal during sapphire chemical mechanical polishing

摘要

The effect of mechanical process parameters such as down force and rotation speed on friction behavior and material removal rate (MRR) was investigated during chemical mechanical polishing (CMP) of sapphire substrate. It was found that the increase in both rotation speed and down force can enhance the MRR and friction force almost linearly depends on the down force and rotation speed. The coefficient of friction (COF) decreases with increasing rotation speed under a fixed down force but keeps constant regardless of variation in down force under a fixed rotation speed. Moreover, the relationship between friction force and MRR was obtained. MRR was proportional to friction force with increasing down force whereas converse proportional to that with increasing the rotation speed. In addition, MRR data are fitted to the Preston equation in the sapphire CMP.