Exploiting the combination of 3D polymer printing and inkjet Ag-nanoparticle printing for advanced packaging

摘要

A rapid advanced packaging concept, consisting of 3D photopolymer printing and Ag nanoparticle printing, was investigated for the construction of a simple radio frequency identification (RFID) package with integrated surface acoustic wave transponder (SAW). An acrylate-type SAW package housing was printed with a multi-jet 3D printer and the corresponding antenna for the wireless read-out was manufactured via inkjet printing of Ag nanoparticle ink. The corresponding Ag structure had a thickness of about 2 pm with a sheet resistance of 250 m Omega sq(-1) after the photonic sintering processing. The chip-on-board and flip-chip packaging concepts were pursued for connecting the antenna structure to the chip pads. The SAW package prototype in a flip-chip configuration showed a significant signal to noise ratio (SNR) of about 30 dB via antenna-bridged radio frequency link at a moderate distance of 3 cm. (C) 2016 Elsevier B.V. All rights reserved.