Examining scale-up and computer simulation in tool design for 300-mm wafer processing

摘要

Plans to introduce pilot lines and fabs for 300-mm wafer processing are well under way. A 300-mm wafer allows 2.4 to 2.7 times more die per wafer, and a 25-40% reduction in per-die cost. At the same time, IC technology is moving toward 0.18-, 0.15-, and 0.13-μm line-widths. The combination of these two trends places unprecedented demands on wafer processing equipment and presents enormous challenges to equipment manufacturers. Their role in the IC business involves design and development of new-generation equipment as well as development and demonstration of processes compatible with such equipment. As a result, computational modeling is called on now more than ever to play a complementary role in equipment and process design. The development of models and computer simulation codes is being pursued vigorously at universities, government laboratories, and com- mercial vendors. The virtual reactor concept is close to becoming a reality.