Implementing on-line ADC and an automated yield information management system

摘要

When a wafer fab processes a large number of different logic devices at several technology nodes simultaneously, its defect-sampling strategy at any given time must focus on two types of devices: those with the most advanced technology and those being produced in the highest volume. This diversity of data challenges automatic defect classification (ADC) systems in several ways. Not only must the ADC classifiers be portable across different device types within the same technology node, but the classification data must also be analyzed quickly and efficiently to prevent yield losses caused by defect excursions. A strong yield management program that can react to both ADC and manually classified defect data is critical to the fab's continued success.