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Effect of SiC particle size on flexural strength of porous self-bonded SiC ceramics

机译:SiC粒径对多孔自粘结SiC陶瓷弯曲强度的影响

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摘要

Porous self-bonded silicon carbide (SBSC) ceramics were fabricated from SiC powders with various particle sizes (0.7 μm, 25 μm, 50 μm, 65 μm), plus Si, C and boron (as a sintering additive). The effects of submicron (0.7 μm) SiC particle incorporation into the SBSC and the SiC particle size (25 μm, 50 μm, 65 μm) on the flexural strength and porosity of the ceramics were investigated as a function of sintering temperature. Incorporating 0.7 μm SiC particles into the ceramic material containing 25 μm SiC particles increased the flexural strength by 3 times, from 11.7 MPa up to 35.5 MPa after sintering at 1800 °C. Simultaneously, the porosity was reduced by ∼5 %. Furthermore, the flexural strength of ceramic with 25 μm SiC particles was superior to that with 65 μm SiC particles. Generally, the flexural strength of the SBSC increased as, both, a function of submicron SiC particle incorporation along with relatively small micron-sized particles (25 μm) in the microstructure of the ceramic plus increased sintering temperature.
机译:多孔自粘结碳化硅(SBSC)陶瓷是由具有各种粒径(0.7μm,25μm,50μm,65μm),以及Si,C和硼(作为烧结添加剂)的SiC粉末制成的。研究了将亚微米(0.7μm)SiC颗粒掺入SBSC中以及SiC颗粒尺寸(25μm,50μm,65μm)对陶瓷抗弯强度和孔隙率的影响,其与烧结温度有关。在1800°C烧结后,将0.7μmSiC颗粒掺入包含25μmSiC颗粒的陶瓷材料中,抗弯强度提高了3倍,从11.7 MPa到35.5 MPa。同时,孔隙率降低了约5%。此外,具有25μmSiC颗粒的陶瓷的抗弯强度要优于具有65μmSiC颗粒的陶瓷的抗弯强度。通常,SBSC的抗弯强度随着亚微米SiC颗粒的结合以及陶瓷微结构中相对较小的微米级颗粒(25μm)的增加以及烧结温度的升高而增加。

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