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A Tribological Study of Electrodeposited Gold-Copper-Cadmium

机译:电沉积金铜镉的摩擦学研究

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摘要

The relationships between mechanical properties and tribological behavior of 14-, 18-, and 23-kt gold-copper-cadmium electrodeposited alloys were reported on. In order to obtain significant results, compositional homogeneity of the samples must be ensured: this was achieved by growing the alloys under controlled hydrodynamic conditions. Two tribological failure mechanisms were observed: at low loads the alloys fail by microcutting, at higher loads coatings tend to detach from the substrate. The former mechanism is typical for the bulk material, the latter one depends on the coating-substrate system. Material loss brought about by microcutting can be correlated with an Archard-type relationship corrected for toughness effects. Critical loads for coating detachment depend on deposit-substrate adhesion energy.
机译:报道了14-kt,18-kt和23-kt金-铜-镉电沉积合金的力学性能与摩擦学行为之间的关系。为了获得显着的结果,必须确保样品的成分均匀性:这是通过在受控的流体动力学条件下生长合金来实现的。观察到两种摩擦学失效机理:在低负荷下,合金通过微切削而失效;在高负荷下,涂层往往会从基体上脱落。前一种机制是散装材料的典型机制,后一种机制取决于涂层-基材系统。显微切割带来的材料损失可以与针对韧性影响校正的Archard型关系相关联。涂层剥离的临界载荷取决于沉积物与基底的粘附能。

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