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首页> 外文期刊>Mechanics of materials >The effect of thin film adhesives on mode Ⅱ interlaminar fracture toughness in carbon fiber composites with shape memory alloy inserts
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The effect of thin film adhesives on mode Ⅱ interlaminar fracture toughness in carbon fiber composites with shape memory alloy inserts

机译:薄膜粘合剂对形状记忆合金嵌件碳纤维复合材料Ⅱ型层间断裂韧性的影响

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摘要

A single sheet of nickel-titanium (NiTi) shape memory alloy (SMA) was introduced within an IM7/8552 polymer matrix composite (PMC) panel in conjunction with multiple thin film adhesives to promote the interfacial bond strength between the SMA and PMC. End notched flexure (ENF) testing was performed in accordance to ASTM D7905 method for evaluation of mode II interlaminar fracture toughness (G(IIC)) of unidirectional fiber-reinforced polymer matrix composites. Acoustic emissions (AE) were monitored during testing with two acoustic sensors attached to the specimens. The composite panels examined using scanning electron microscopy techniques after part failure. G(IIC) values for the control composite samples were found to be higher than those of samples with embedded SMA sheets. The presence of adhesives bonded to SMA sheets further diminished the G(IIC) values. AE values revealed poor bonding of the panels, with little to no signals during testing.
机译:将单片镍钛(NiTi)形状记忆合金(SMA)与多种薄膜粘合剂一起引入IM7 / 8552聚合物基复合材料(PMC)面板中,以提高SMA和PMC之间的界面结合强度。根据ASTM D7905方法进行端部切口挠曲(ENF)测试,以评估单向纤维增强聚合物基复合材料的II型层间断裂韧性(G(IIC))。在测试过程中,使用两个附着在样品上的声传感器来监测声发射(AE)。零件失效后,使用扫描电子显微镜技术检查复合板。发现对照复合样品的G(IIC)值高于带有嵌入SMA片的样品的G(IIC)值。粘合到SMA片材的粘合剂的存在进一步降低了G(IIC)值。 AE值表明面板粘结不良,在测试过程中几乎没有信号。

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