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首页> 外文期刊>Materials science forum >CVD Filling of Narrow Deep 4H-SiC Trenches in a Quasi-Selective Epitaxial Growth Mode
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CVD Filling of Narrow Deep 4H-SiC Trenches in a Quasi-Selective Epitaxial Growth Mode

机译:准选择性外延生长模式中窄深4H-SiC沟槽的CVD填充

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摘要

By mapping the source and HCl flow rates dependent growth rates, the evolving trend of a quasi-selective epitaxial growth (quasi-SEG) that growing very thin epilayer on mesa top and ensuring an extremely low risk of voids defect generation was firstly figured out on a 5-μm 4H-SiC trench. Then, basing on the acquired knowledge, a 25-μm 4H-SiC trench with an aspect ratio up to ~10 was completely filled in the quasi-SEG mode.
机译:通过绘制与源和HCl流量相关的增长率的图,首先发现了准选择性外延生长(准SEG)的演变趋势,即在台面顶部生长非常薄的外延层并确保极低的产生空洞缺陷的风险。 5μm的4H-SiC沟槽。然后,根据所获得的知识,以准SEG模式完全填充纵横比高达〜10的25μm4H-SiC沟槽。

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