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Influence of Technological Process for Microelectromechanical Sensors Manufacturing on their Technical Characteristics

机译:微机电传感器制造技术工艺对其技术特征的影响

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摘要

The article discusses the technological process for MEMS sensors manufacturing, which provides the minimum allowable technological defects to achieve MEMS technical characteristics. The paper deals with experiments on the definition of technological operations and the choice of their parameters. The factors influencing the size of technological defects are revealed. There is a technology to manufacture MEMS considered as "silicon on glass." There were successful experiments with the use of mask thickness of 540 nm and 450 nm. The slope of the faces does not exceed 1o, the maximum height of the surface roughness profile was 75 nm.
机译:本文讨论了MEMS传感器制造的技术过程,它提供了实现MEMS技术特征的最小允许的技术缺陷。本文涉及技术运营定义和其参数的定义的实验。揭示了影响技术缺陷规模的因素。有一种技术可以制造被认为是“玻璃上的硅”。使用掩模厚度为540nm和450nm的掩模厚度有成功的实验。面的斜率不超过1o,表面粗糙度曲线的最大高度为75nm。

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