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Dynamic softening mechanism of 30 % SiCp/2024Al composite during hot deformation process

机译:30%SiCp / 2024Al复合材料热变形过程中的动态软化机理

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Using Gleeb-1500D simulator, the isothermal compression tests of 30% SiCp/2024Al (volume fraction) are conducted at a temperature range of 623K - 773K and a strain rate range of 0.01s(-1) - 10s(-1). The softening mechanism of composites during hot deformation has been proposed based on the Zener-Hollomon parameter Z, deformation temperature T and microstructure analysis. Cross slip of dislocation plays a dominant role under the conditions of lnZ59.634 and T673K. While, deformation mechanisms such as cross slip, climb of dislocation and unzipping of the three dimensional dislocation network play a joint role when lnZ61.933 and T623K. Particularly, dynamic recrystallization occurred when lnZ55.669 and T723K. The cross slip, climb and unzipping of dislocation and dynamic recrystallization are the main softening mechanisms. The role of the dynamic recrystallization mechanisms become more significant and the critical strain of dynamic recrystallization decrease with the decrease of lnZ. Dynamic recrystallization nucleation mechanisms are mainly constituted of the subgrain combination and the bulging of the grain boundary.
机译:使用Gleeb-1500D仿真器,在623K-773K的温度范围和0.01s(-1)-10s(-1)的应变率范围内进行了30%SiCp / 2024Al(体积分数)的等温压缩测试。基于Zener-Hollomon参数Z,变形温度T和显微组织分析,提出了复合材料热变形过程中的软化机理。位错的交叉滑移在lnZ59.634和T673K的条件下起主要作用。而当lnZ61.933和T623K时,诸如横向滑移,位错爬升和三维位错网络解压缩等变形机制起着共同的作用。特别是,当lnZ55.669和T723K时发生动态重结晶。错位的横向滑移,爬升和解压以及动态再结晶是主要的软化机制。随着lnZ的减少,动态再结晶机理的作用变得更加重要,动态再结晶的临界应变也降低了。动态再结晶成核机制主要由亚晶粒组合和晶界凸起组成。

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