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Flow stress and microstructures of fine grained copper

机译:细晶粒铜的流动应力和微观结构

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摘要

For a fine grained pure copper (grain size, 3.8 μm) with a weak initial texture, the flow stress and the microstructure have been examined. The stress-strain curve has been compared with that of a coarse grained copper with a weak texture and a similar curve shape has been found, indicating no change in the strain hardening behavior as the grain size is decreased. The validity of the Hall-Petch relationship has been demonstrated down to a grain size of 3.8 μm. Careful microstructural characterization of deformed specimens has shown that the microstructural evolution in the fine grained copper follows the same pattern previously established for larger grain sizes, which is characterized by the formation of three types of microstructures depending on the grain orientation. This observation suggests that the slip patterns in the fine grained and coarse grained copper are comparable, which underpin the observation of a comparable stress-strain behavior.
机译:对于具有较弱初始质地的细晶粒纯铜(晶粒尺寸为3.8μm),已检查了其流动应力和微观结构。将应力-应变曲线与质地较弱的粗晶粒铜的应力-应变曲线进行了比较,发现了相似的曲线形状,这表明随着晶粒尺寸的减小,应变硬化行为没有变化。霍尔-Petch关系的有效性已被证明低至3.8μm的晶粒尺寸。仔细观察变形样品的微观结构特征表明,细晶粒铜的微观结构演变遵循先前为较大晶粒而建立的相同模式,其特征是根据晶粒取向形成三种类型的微观结构。该观察结果表明,细晶粒铜和粗晶粒铜中的滑动模式是可比较的,这支持了可比较的应力应变行为的观察。

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