Molecular dynamics study of scratching velocity dependency in AFM-based nanometric scratching process

摘要

Three-dimensional molecular dynamics simulations are performed to investigate the AFM-based nanometric scratching process of monocrystalline copper. The effects of scratching velocities (1, 10, and 100 m/s) on the chip pattern, scratching resistance, dislocation movement, and workpiece deformation are studied. The results show that the scratching resistance increases with the increase in scratching velocity. The higher scratching velocity results in larger chip volume and closer chip shape with more amorphous structure. The dislocations move well-regulated for lower velocities (1 and 10 m/s) than that for larger one (100 m/s). The area of workpiece material deformation region beneath the tool edge decreases with the increase in scratching velocity.