首页> 外文会议>ASME microanoscale heat and mass transfer international conference;MNHMT2009 >Molecular Dynamics Studies of Heat and Stresses in Copper Substrate Scratch with Double-walled Nano-cones
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Molecular Dynamics Studies of Heat and Stresses in Copper Substrate Scratch with Double-walled Nano-cones

机译:双壁纳米锥在铜基底划痕中热和应力的分子动力学研究

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It is of scientific and industrial importance to obtain detailed understanding of heat transfer and stress distributions in the substrate under nano-scale scratching. In this study, the copper (110) substrate was chosen, and the scratching tip was a double-walled nano-cone. It is found that the double-walled nano-cones are more workable than single-walled nano-cones and carbon nanotubes. Moreover, repeated scratches show high aspect-ratio trenches could be obtained by the manufacturing technique. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. It is found the temperature rises locally near the scratch tip, and trailing thermal waves were more prominent than the leading thermal waves. For the case of the scratching temperature at 700 K, the highest temperature during the scratch was found to be about 850 K.
机译:详细了解纳米尺度划痕下基材中的传热和应力分布具有科学和工业重要性。在这项研究中,选择了铜(110)衬底,刮擦尖端为双壁纳米锥。发现双壁纳米锥比单壁纳米锥和碳纳米管更可行。此外,重复的划痕表明可以通过制造技术获得高的纵横比沟槽。时域传热和应力分析是通过使用具有原子空间分辨率的控制体积技术进行的,除了边界附近。发现温度在刮擦尖端附近局部升高,并且尾随的热波比起前的热波更突出。对于刮擦温度为700 K的情况,发现刮擦过程中的最高温度约为850K。

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