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Grain-size stabilization by impurities and effect on stress-coupled grain growth in nanocrystalline Al thin films

机译:杂质对晶粒尺寸的稳定作用及其对纳米Al薄膜中应力耦合晶粒生长的影响

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摘要

Room-temperature tensile experiments on sub-micrometer freestanding thin films deposited at varied base pressures reveal two distinct classes of mechanical response. Samples that contain sufficient impurity concentrations to stabilize the microstructure against an applied stress show strong but brittle response. However, films that were deposited at lower vacuum base pressures that still allow for thermally stable nanostructures show remarkably different deformation response; namely, moderate strength and over 15% plastic strain to failure. Post-mortem transmission electron microscopy of deformed samples with different levels of impurity pinning atmospheres reveals stress-driven discontinuous grain growth that facilitates a fundamental change in the deformation behavior of these thin films. The results indicate a critical impurity concentration to sufficiently pin or immobilize grain boundaries against the coupling of applied stresses.
机译:在变化的基础压力下沉积的亚微米独立式薄膜的室温拉伸实验显示出两种截然不同的机械响应。包含足够的杂质浓度以稳定微结构以抵抗施加应力的样品显示出强而脆的响应。但是,在较低的真空基本压力下沉积的薄膜仍然允许热稳定的纳米结构,它们显示出明显不同的变形响应。即中等强度,超过15%的塑性应变破坏。具有不同水平的杂质钉扎气氛的变形样品的事后透射电子显微镜显示出应力驱动的不连续晶粒生长,这促进了这些薄膜的变形行为的根本变化。结果表明,临界杂质浓度足以抵抗施加应力的耦合而充分钉扎或固定晶界。

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