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Ostwald ripening of faceted Si particles in an Al-Si-Cu melt

机译:Al-Si-Cu熔体中刻面Si颗粒的Ostwald成熟

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摘要

The microstructural evolution of an Al-Si-Cu alloy during Ostwald ripening is imaged via synchrotron-based, four-dimensional (i.e., space and time resolved) X-ray tomography. Samples of composition Al-32 wt%Si-15 wt%Cu were annealed isothermally at 650 ℃, in the two-phase solid-liquid regime, while tomographic projections were collected in situ over the course of five hours. Advances in experimental methods and computational approaches enable us to characterize the local interfacial curvatures and velocities during ripening. The sequence of three-dimensional reconstructions and interfacial shape distributions shows highly faceted Si particles in a copper-enriched liquid, that become increasingly isotropic or rounded over time. In addition, we find that the coarsening rate constant is approximately the same in the binary and ternary systems. By coupling these experimental measurements with CAL-PHAD modeling and ab initio molecular dynamics simulation, we assess the influence of Cu on the coarsening process. Finally, we find the unusual "pinning" of microstructure at the junction between rough and smooth interfaces and suggest a mechanism for this behavior.
机译:奥斯特瓦尔德(Ostwald)熟化过程中Al-Si-Cu合金的微观结构演变是通过基于同步加速器的四维(即空间和时间分辨)X射线断层扫描成像的。 Al-32 wt%Si-15 wt%Cu的组成样品在两相固液状态下于650℃等温退火,而在五个小时的过程中就地收集了层析成像投影。实验方法和计算方法的进步使我们能够表征成熟过程中的局部界面曲率和速度。三维重建和界面形状分布的序列显示出,在富含铜的液体中高度刻面的Si颗粒随时间的推移逐渐变得各向同性或变圆。此外,我们发现在二元和三元系统中,粗化速率常数大致相同。通过将这些实验测量结果与CAL-PHAD建模和从头算分子动力学模拟相结合,我们评估了Cu对粗化过程的影响。最后,我们在粗糙和光滑的界面之间的交界处发现了异常的微观结构“钉扎”现象,并提出了这种行为的机制。

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