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首页> 外文期刊>Materials Science and Engineering >Microstructure evolution characteristics of Inconel 625 alloy from selective laser melting to heat treatment
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Microstructure evolution characteristics of Inconel 625 alloy from selective laser melting to heat treatment

机译:Inconel 625合金从选择性激光熔化到热处理的组织演变特征

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Superalloy Inconel 625 has been widely used in selective laser melting (SLM). Since SLM-induced microstructure with columnar grains, strong texture, porosity, and undesired properties, heat treatment is often used to tune the microstructure and mechanical properties. However, the microstructure evolution of IN 625 from SLM to heat treatment is poorly understood. In this study, IN 625 samples were SLMed and then heat treated at elevated temperatures. Microstructure evolution characteristics of the processed IN 625 alloy have been characterized using optical metallography, scanning electron microscopy (SEM), electron backscatter diffraction (EBSD), transmission electron microscopy (TEM), X-ray diffraction, and micro indentation. Fine dendrite microstructures with strong texture parallel to layer build-up direction was observed in the as-SLM samples due to rapid cooling and epitaxial growth. High dislocation density and high microhardness were found in the γ matrix which also contains high Z-contrast precipitates. After annealing at high temperatures, random grain growth accompanied by dislocation annihilation and twinning occurs. The decrease in lattice parameter and the prevalence of large grain boundary misorientation in the γ matrix suggests that SLM-induced residual stress be significantly reduced. In addition, the uncertainty of mechanical properties due to the process variations was quantified.
机译:超级合金Inconel 625已广泛用于选择性激光熔化(SLM)。由于SLM诱导的具有柱状晶粒,强纹理,孔隙率和不良特性的微观结构,因此经常使用热处理来调整微观结构和力学性能。但是,人们对IN 625从SLM到热处理的微观结构演变知之甚少。在这项研究中,对IN 625样品进行了SLM处理,然后在高温下进行了热处理。使用光学金相学,扫描电子显微镜(SEM),电子背散射衍射(EBSD),透射电子显微镜(TEM),X射线衍射和微压痕对经过加工的IN 625合金的微观组织演化特征进行了表征。由于快速冷却和外延生长,在as-SLM样品中观察到了具有与层堆积方向平行的强纹理的精细枝晶微结构。在γ矩阵中发现了高位错密度和高显微硬度,γ矩阵中也含有高Z值的沉淀。在高温下退火后,随机晶粒长大并伴随着位错location灭和孪晶。晶格参数的减小和γ矩阵中大晶界取向错误的普遍性表明,SLM引起的残余应力显着降低。另外,量化了由于工艺变化引起的机械性能的不确定性。

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