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Microstructural characterisation of TiAl thin films grown by DC magnetron co-sputtering technique

机译:直流磁控共溅射技术生长TiAl薄膜的微观结构表征

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The present study deals with the in situ growth of <111> oriented thin films of TiAl grown by co-sputtering from high purity Ti and Al targets in a DC magnetron sputtering system. The influence of substrate temperature on the chemical and microstructural changes occurring in TiAl thin films has been investigated in the substrate temperature range 573-873 K. Electron probe microanalysis shows that Al concentration increases form 55.78 to 62.15 at./100, while Ti concentration decreases from 44.22 to 37.85 at./100 with increase in the substrate temperature. Atomic force microscopy (AFM) of the TiAl films indicates an increase in the crystallite size with substrate temperature. A fine globular morphology of crystalllites with a mean surface area of ~surface area of ~2300 nm~2 at 773 K.
机译:本研究涉及通过在直流磁控溅射系统中从高纯度Ti和Al靶材共溅射生长的<111>取向TiAl薄膜的原位生长。已经研究了在573-873 K的基板温度范围内基板温度对TiAl薄膜中化学和微观结构变化的影响。电子探针显微分析表明,Al浓度从55.78至62.15 at./100 at升高,而Ti浓度降低从44.22到37.85 at./100,随着基板温度的升高。 TiAl薄膜的原子力显微镜(AFM)表明,微晶尺寸随基材温度的增加而增加。 773 K下平均表面积为〜2300 nm〜2的微晶细小球状晶体。

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