Study on composite electroforming of Cu/SiC_p Composites

摘要

The composite electroforming technology was propounded to fabricate silicon carbide powder (SiC_p) reinforced copper-based composites. The influences of the concentration of SiC_p in plating solution, the temperature of plating solution and current density on the SiC_p content in Cu/SiC_p composites were studied. Results showed that it could promote codeposition of Cu and SiC_p and increase SiC_p content in composites effectively through optimizing the technology parameters. Results of the study on thermal and mechanical properties of Cu/SiC_p composites indicated that with SiC~ content (vol. percent) increasing, bend strength and HV (Vickers hardness) increased, but coefficient of thermal expansion (CTE) and conductivity factor decreased. In addition, internal stress existed in Cu/SiC_p composites, which had influences on HV and thermal expansion property of Cu/SiC_p composites.