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Crystal Structure, Thermal Expansion And Electrical Properties Of A New Compound Al_(0.33)dyge_2

机译:新型化合物Al_(0.33)dyge_2的晶体结构,热膨胀和电性能

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A new ternary compound Al_(0.33)DyGe_2 has been synthesized and studied from 298 K to773 K by means of X-ray powder diffraction technique. The crystal structural refinement of Al_(0.33)DyGe_2 has been performed by using the Rietveld method. The ternary compound Al_(0.33)DyGe_2 crystallizes in the orthorhombic of the defect CeNiSi2-type structure (space group Cmcm, a = 0.41018(2)nm, b= 1.62323(6)nm. c = 0.39463(1)nm, Z = 4 and D_(calc) = 8.004 g/cm~3). The average thermal expansion coefficients α_a, α_b and α_c of Al_(0.33)DyGe_2 are 1.96 ×10~(-5) K~(-1), 0.93 ×10~(-5) K~(-1) and 1.42 ×10~(-5) K~(-1), respectively. The bulk thermal expansion coefficient α_V is 4.31 × 10~(-5) K~(-1). The resistivity is observed to fall from 387 to 308 μΩ cm between room temperature and 25 K.
机译:合成了一种新的三元化合物Al_(0.33)DyGe_2,并利用X射线粉末衍射技术在298 K〜773 K范围内对其进行了研究。 Al_(0.33)DyGe_2的晶体结构细化已通过使用Rietveld方法进行。三元化合物Al_(0.33)DyGe_2在缺陷CeNiSi2型结构(空间群Cmcm,a = 0.41018(2)nm,b = 1.62323(6)nm。c = 0.39463(1)nm,Z = 4和D_(计算)= 8.004 g / cm〜3)。 Al_(0.33)DyGe_2的平均热膨胀系数α_a,α_b和α_c为1.96×10〜(-5)K〜(-1),0.93×10〜(-5)K〜(-1)和1.42×10 〜(-5)K〜(-1)。体积热膨胀系数α_V为4.31×10〜(-5)K〜(-1)。在室温和25 K之间观察到电阻率从387降至308μΩcm。

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