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Effect Of Cuo Addition To Nd(zn_(1/2)ti_(1/2))o_3 Ceramics On Sintering Behavior And Microwave Dielectric Properties

机译:和(zn(1/2)至(1/2))o_3陶瓷中Cu的添加对烧结行为和微波介电性能的影响

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The microwave dielectric properties and microstructures of CuO-doped Nd(Zn_(1/2)Ti_(1/2))O_3 ceramics prepared by the conventional solid-state route were investigated. The prepared Nd(Zn_(1/2)Ti_(1/2))O_3 exhibits a mixture of Zn and Ti showing 1:1 order in the B-site. As an appropriate sintering aid, not only did CuO lower the sintering temperature, it could effectively hold back the evaporation of Zn in the Nd(Zn_(1/2)Ti_(1/2))O_3. Moreover, CuO only resided in boundaries, which was confirmed by EDX analysis. The measured lattice parameters of CuO-doped Nd (Zn_(1/2)Ti_(1/2))O_3 (a=5.4652±0.0005 A, b=5.6399+0.0007 A, c=7.7797±0.0008 A and β=90.01 +0.01°) retained identical to that of the pure Nd (Zn_(1/2)Ti_(1/2))O_3 in all cases. In comparison with the pure (Zn_(1/2)Ti_(1/2))O_3 ceramics, specimen with 1 wt.% CuO addition possesses a compatible combination of dielectric properties with a ε_r of 30.68, a Q×f of 158,000 GHz (at 8 GHz) and a τ_f of -45 pprn/℃ at 1270℃. It also indicated a 60℃ lowering in the sintering temperature. The proposed dielectrics can be a very promising candidate material for microwave or millimeter wave applications requiring extremely low dielectric loss.
机译:研究了通过常规固态法制备的掺杂CuO的Nd(Zn_(1/2)Ti_(1/2)Ti_(1/2))O_3陶瓷的微波介电性能和微观结构。制备的Nd(Zn_(1/2)Ti_(1/2))O_3表现出Zn和Ti的混合物,在B位显示出1:1的顺序。作为一种合适的烧结助剂,CuO不仅降低了烧结温度,还可以有效地抑制Nd(Zn_(1/2)Ti_(1/2))O_3中Zn的蒸发。此外,通过EDX分析证实,CuO仅存在于边界中。 CuO掺杂Nd(Zn_(1/2)Ti_(1/2))O_3的测量晶格参数(a = 5.4652±0.0005 A,b = 5.6399 + 0.0007 A,c = 7.7797±0.0008 A和β= 90.01 +在所有情况下,0.01°)保持与纯Nd(Zn_(1/2)Ti_(1/2))O_3相同。与纯(Zn_(1/2)Ti_(1/2))O_3陶瓷相比,添加1 wt。%CuO的样品具​​有介电性能的兼容组合,其ε_r为30.68,Q×f为158,000 GHz (在8 GHz下),在1270℃时τ_f为-45 pprn /℃。这也表明烧结温度降低了60℃。对于要求极低介电损耗的微波或毫米波应用,建议的介电材料可能是非常有前途的候选材料。

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