Corrosion behavior of bulk nanocrystalline copper in ammonia solution

摘要

Corrosion behavior of copper bulk with grain size of 48 nm prepared by inert gas condensation and in situ warm compress (IGCWC) technique was investigated in 0.3 wt.% ammonia solution. The nanocrystalline (NC) Cu sample displayed an active-passive-transpassive behavior with the formation of duplex passive films but without stable passive regions in potentiodynamic polarization process. NC Cu exhibited slightly inferior corrosion resistance when compared with coarse-grained (CG) Cu. It could be explained by both the higher grain boundary density that could accelerate corrosion reactions and the loose passive film formed on the surface of NC Cu that couldn't provide effective protection.