机译:通过控制Ni金属化层的晶粒结构来缓和Sn-Ag-Cu / Ni焊点中(Cu,Ni)_6Sn_5的剥落
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013 Taiwan;
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013 Taiwan;
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013 Taiwan;
Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu, 30013 Taiwan;
Electronic materials; Intermetallic alloys and compounds; Phase transformation; Microstructure;
机译:冲击裂纹在Sn-Ag-Cu / Ni焊点中通过(Cu,Ni)_6Sn_5双相层扩展
机译:Ni_3Sn_4和(Cu,Ni)_6Sn_5金属间化合物层对焊点中Pd和Ni交叉相互作用的影响
机译:Ni-Sn-0.7Cu-0.05Ni / Cu球栅阵列(BGA)接头的(Cu,Ni)_6Sn_5金属间层中的Ni偏析
机译:Cu / Ni-P / Au金属化过程中回流的Sn-Ag和Sn-Ag-Cu无铅焊料的界面微观结构和接头强度
机译:用于无传感器执行器位置控制的Ni-Ti和Ni-Ti-Cu形状记忆合金的应力-应变-电阻行为建模。
机译:Ni / Sn / Ni微型焊点力学性能的IMC微观结构演变依赖性
机译:sn-ag和sn-ag-Cu无铅焊料的界面微观结构和接合强度回流Cu / Ni-p / au金属化
机译:弹性微分有效截面和非弹性得到了44兆电子伏的释放颗粒αON TaRGET:为24mg,25毫克,26mG,40Ca,46Ti,48Ti,50Ti,52Cr,54Fe,的56Fe,58Fe,58Ni,60Ni,62NI,64Ni, 63Cu,65Cu,64Zn,112sn,114sn,116s