A titanium-nickel composite mold with low surface energy for thermal nanoimprint lithography

摘要

As thermal nanoimprint lithography offers promising potential in industrial manufacture, it is more and more desirable to obtain a suitable mold with good anti-adhesive property. In this study, we developed a new fabrication route of nickel mold based on the commonly used electroplating process. Utilizing titanium as the seed layer material and surface modification basis, perfluoroalkyl trichlorosilane was simply and firmly bonded to the surface of the titanium-nickel composite mold, offering a low surface energy state and a good anti-adhesive property. The availability of high-quality anti-adhesive coatings makes titanium-nickel composite molds well suitable for thermal nanoimprint lithography. (C) 2019 Elsevier B.V. All rights reserved.