Abnormal effect of temperature on intermetallic compound layer growth at aluminum-titanium interface: The role of grain boundary diffusion

摘要

The Al3Ti intermetallic compound (IMC) layer growth kinetics at Al-Ti interface was investigated. Surprisingly an abnormal effect of temperature was observed with a thicker IMC layer formed at lower annealing temperature due to the much faster Al3Ti grain coarsening at a higher temperature, the IMC layer growth at 630 degrees C became slower than that at 600 degrees C after a certain annealing time. The quantitative influence of grain size on effective diffusion coefficient was analysed. Calculations showed that the lattice diffusion makes little contribution to the effective diffusion coefficient. Grain boundary diffusion, therefore, dominates for all the annealing conditions studied. (C) 2019 Elsevier B.V. All rights reserved.