Effect of Ag/Cu matrix composition on thermal properties of diamond/ Ag/Cu-Ti composites fabricated by pressureless sintering

摘要

Diamond/Ag/Cu-Ti composites were fabricated by low-cost pressureless sintering with Ti addition to improve the diamond-metal matrix wettability and the effects of Ag/Cu matrix variation on the composites were investigated. Transmission electron microscopy identified the interfacial structure on the diamond (1 0 0) plane of the diamond/Ag/Cu-Ti composite with the 80 at.% Cu matrix as Cu-Ag/TiC/Ag-C/TiC/diamond. The thermal conductivity of the diamond/Ag/Cu-Ti composites was significantly enhanced upon increasing the Ag contents of the Ag/Cu matrix. The 60 vol% diamond/Ag/Cu-2 at.% Ti composite with 40 at.% Cu matrix content exhibited the maximum thermal conductivity of 826 W/m.K and the compatible coefficient of thermal expansion of 6.0 ppm/K. The diamond/Ag/Cu-Ti composites are promising low-cost thermal management materials for electronic device integration. (C) 2019 Elsevier B.V. All rights reserved.