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首页> 外文期刊>Materials Chemistry and Physics >The effect of particle size and volume fraction of the reinforced phases on the linear thermal expansion in the Al-Si-SiCp system
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The effect of particle size and volume fraction of the reinforced phases on the linear thermal expansion in the Al-Si-SiCp system

机译:增强相的粒径和体积分数对Al-Si-SiCp系统中线性热膨胀的影响

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摘要

Al-Si-SiCp composite systems were fabricated by spray-casting process and subsequently hot-extruded, and the effects of microstructural parameters, such as the volume fraction and particle size of the reinforced SiCp and Si phases on the linear coefficient of thermal expansion (CTE) were investigated. It revealed that the increase in the volume fraction of SiCp reinforcements lowers the linear CTE of the Al-Si-SiCp composite system, and the CTE of this system is proportional to the size of the crystallized silicon phase.The linear CTEs of the Al-Si-SiCp ternary systems were calculated for various sizes and volume fractions of the reinforced phases in the temperature range from 20 to 300degreesC. It seems that the calculated CTEs agree well with the measured values. However, it showed that the calculated CTE values deviate slightly from previous reported ones at around 50 vol. % SiCp. Such deviations seem to be attributed to the combined effects of interfacial characteristics among phases in the system and other metallurgical factors such as shapes of reinforced phases, the probability of physical contact between phases, and porosities. Despite these deviations, it was verified that the linear CTEs of Al-Si-SiCp could be influenced considerably by the size of the reinforced phases. (C) 2004 Elsevier B.V. All rights reserved.
机译:Al-Si-SiCp复合材料系统是通过喷射铸造工艺制造的,然后进行热挤压,并且微观结构参数如增强SiCp和Si相的体积分数和粒径对线性热膨胀系数的影响( CTE)。结果表明,SiCp增强材料体积分数的增加降低了Al-Si-SiCp复合材料体系的线性CTE,且该体系的CTE与结晶硅相的尺寸成正比。计算了Si-SiCp三元体系在20至300℃温度范围内各种尺寸和体积分数的增强相。似乎计算出的CTE与测量值非常吻合。但是,它表明,计算出的CTE值在50体积左右时与先前报道的略有不同。 SiCp%。这种偏差似乎归因于系统中各相之间的界面特性和其他冶金因素(如增强相的形状,各相之间物理接触的可能性和孔隙率)的综合作用。尽管存在这些偏差,但已证实,Al-Si-SiCp的线性CTE可能会受到增强相尺寸的很大影响。 (C)2004 Elsevier B.V.保留所有权利。

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