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机译:镍中间层Mo / Cu接头扩散焊接的组织和结合强度
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
State Key Laboratory of Advanced Technology for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan 430070, PR China;
D. diffusion bonding; E. mechanical; F. microstructure;
机译:粘合时间对真空扩散粘合超镍/ NiCR层压复合物与无中间层的界面微观结构和剪切强度的影响
机译:镍中间层对扩散结合Mo / Cu接头强度和组织的影响
机译:铜/镍电镀中间层WC-Co / 90MnCrV8冷作工具钢扩散结合接头的界面组织和力学强度
机译:加载方法对AZ31b / Cu与Ni中间层扩散焊接接头组织的影响
机译:液相扩散键合和用于高温无铅电气连接的Cu-Ni / Sn复合焊膏的开发
机译:(111)定向和纳米孪晶铜的结合界面微观结构与铜-铜接头的剪切强度之间的相关性
机译:通过真空扩散键合与Cu中间层的ET / 00CR17NI14MO2不锈钢的元素扩散