机译:使用BNi2中间层的GH3039高温合金与IC10单晶的瞬时液相键合:微观结构和力学性能
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China;
Transient liquid phase bonding; Isothermal solidification; Mechanical properties; Microstructure; Nickel superalloys;
机译:IC10单晶和GH3039超合金不同激光束焊接接头的焊接性和力学性能
机译:硼和硅对瞬态液相键合GH3039 / IC10接头组织和力学性能的影响
机译:粘合后热处理对低硼Ni_3Al interlayer的宽间隙TLP粘结IC10超合金组织和力学性能的影响
机译:单晶的宽间隙瞬态液相粘合到多晶硅镍基超合金:微观结构发育和机械性能
机译:单晶高温合金瞬态液相键合的数值模拟和实验研究。
机译:TiAl合金与GH3039高温合金摩擦焊接界面的微观力学性能。
机译:TLP键合中间层中的单晶性能。 Ni基单晶超合金的瞬态液相键合。 (报告6)。