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首页> 外文期刊>Materials & design >Full-field measurement with nanometric accuracy of 3D superficial displacements by digital profile correlation: A powerful tool for mechanics of materials
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Full-field measurement with nanometric accuracy of 3D superficial displacements by digital profile correlation: A powerful tool for mechanics of materials

机译:通过数字轮廓关联以3D纳米位移的纳米精度进行全场测量:一种用于材料力学的强大工具

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摘要

In recent decades, technological innovations have prompted the development of pioneering materials that attempt to satisfy new and forthcoming needs. The innovation in these materials is usually from their peculiar properties, which in many cases make them uniquely appropriate for a specific application. In this context, the development of innovative measurement techniques can provide more comprehensive understanding and knowledge of these materials' properties, often non-conventional and not easily retrieved by standard procedures. In order to obtain a full-field 3D displacement vector of a surface under investigation, the author proposes the combination of two well-known measurement techniques: the Confocal Microscopy (CM) and the two-dimensional Digital Image Correlation (2D-DIC). Specifically, CM has demonstrated its ability to successfully attain microscopic topography on a highly finished surface with sub-micrometric roughness, and such a technique could be used as a carrier to successfully apply the 2D-DIC algorithm. By this approach, it is not difficult to reach an accuracy of a few nanometers on the displacement measurement. The feasibility of the procedure proposed herein was demonstrated by two case studies: a tensile test of a Ni-alloy edge crack specimen, and a hardness test carried out on a thick AISI 1040 disk. (C) 2018 Elsevier Ltd. All rights reserved.
机译:在最近的几十年中,技术创新促使人们尝试开发能够满足新的和即将来临的需求的开拓性材料。这些材料的创新通常来自其独特的特性,在许多情况下,它们使它们特别适合特定的应用。在这种情况下,创新测量技术的发展可以提供对这些材料特性的更全面的理解和知识,这些特性通常是非常规的,并且不易通过标准程序检索。为了获得被调查表面的全场3D位移矢量,作者提出了两种众所周知的测量技术的组合:共聚焦显微镜(CM)和二维数字图像相关(2D-DIC)。具体而言,CM已证明其能够在具有亚微米粗糙度的高度精加工表面上成功获得微观形貌的能力,并且这种技术可以用作成功应用2D-DIC算法的载体。通过这种方法,在位移测量上达到几纳米的精度并不困难。本文中提出的程序的可行性通过两个案例研究得到了证明:镍合金边缘裂纹样品的拉伸测试以及在厚AISI 1040圆盘上进行的硬度测试。 (C)2018 Elsevier Ltd.保留所有权利。

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