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首页> 外文期刊>IEEE transactions on components, packaging, and manufacturing technology. Part A >Minimizing the computational cost and memory requirements for the capacitance calculation of 3-D multiconductor systems
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Minimizing the computational cost and memory requirements for the capacitance calculation of 3-D multiconductor systems

机译:最小化3-D多导体系统电容计算的计算成本和存储要求

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摘要

A new approach is presented which minimized the computational cost and memory requirements for capacitance calculations of three-dimensional multiconductor systems. The proposed approach, based on the integral equation method (IEM), calculated the capacitance of three-dimensional geometry of ideal conductors in two stages. In the first stage, the integral equation method was used to obtain the charge distribution on each conductor in isolation. In the second stage, the multiple interaction (coupling) among the conductors was included by applying the IEM to the whole structure and considering the charge distribution, obtained in the first stage, as a discretized entire domain basis function. The order of the interaction matrix was thus reduced to the order of conductors in the structure. The proposed method was tested for various geometries and it resulted in tremendous savings in computational time and memory storage; moreover, it gave very good accuracy in comparison with the classical integral equation method.
机译:提出了一种新方法,该方法可最大程度地减少三维多导体系统电容计算的计算成本和内存需求。所提出的方法基于积分方程法(IEM),分两阶段计算了理想导体的三维几何形状的电容。在第一阶段,积分方程法用于获得隔离状态下每个导体上的电荷分布。在第二阶段中,通过将IEM应用于整个结构并考虑在第一阶段中获得的电荷分布作为离散化的整个域基函数,来包括导体之间的多重交互作用(耦合)。因此,相互作用矩阵的阶数降低为结构中导体的阶数。该方法针对各种几何形状进行了测试,从而极大地节省了计算时间和存储空间;此外,与经典积分方程法相比,它具有非常好的准确性。

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