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首页> 外文期刊>IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging >A packaging technique for an optical 90/spl deg/-hybrid balanced receiver using a planar lightwave circuit
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A packaging technique for an optical 90/spl deg/-hybrid balanced receiver using a planar lightwave circuit

机译:使用平面光波电路的90 / spl度/杂化光学平衡接收机的封装技术

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A new technique has been developed for packaging an optical 90/spl deg/-hybrid balanced receiver using a planar lightwave circuit (PLC) for the application to an optical homodyne detection system. This receiver consists of a silica-based PLC as an optical coupler, two polarization beam splitters (PBSs), two GRIN rod lenses to achieve perfect optical interconnections, two photoreceivers that each have a preamplifier, and twin p-i-n photodiodes (PIN-PDs). The photoreceivers are fabricated using microsolder bump bonding to eliminate parasitic elements in the interconnections between the preamplifiers and the PIN-PDs. An impedance-matched film carrier technique is used to achieve impedance-matched interconnections between the preamplifiers and the ceramic packages. Experiments showed that a receiver fabricated using this packaging technique has excellent performance: a broad-band frequency response of 14 GHz and, consequently, 10-Gb/s binary phase shift keying (BPSK) homodyne detection.
机译:已经开发出一种新技术,用于使用平面光波电路(PLC)封装光学90 / spl度/混合平衡接收机,用于光学零差检测系统。该接收器由基于二氧化硅的PLC作为光耦合器,两个偏振分束器(PBS),两个GRIN棒状透镜以实现完美的光学互连,两个分别具有前置放大器的光电接收器和两个p-i-n光电二极管(PIN-PD)组成。使用微焊料凸点键合制造光接收器,以消除前置放大器和PIN-PD之间互连中的寄生元素。阻抗匹配的薄膜载体技术用于实现前置放大器和陶瓷封装之间的阻抗匹配的互连。实验表明,使用这种封装技术制造的接收器具有出色的性能:14 GHz的宽带频率响应,因此具有10 Gb / s的二进制相移键控(BPSK)零差检测功能。

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